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ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 12TH 2011. (ICEPT-HDP 2011) (USB)

ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 12TH 2011. (ICEPT-HDP 2011) (USB)

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ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 12TH 2011. (ICEPT-HDP 2011) (USB)
Item #: 13135
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Product Description
Title:2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP 2011)
Desc:Proceedings of a meeting held 8-11 August 2011, Shanghai, China.
Prod#:CFP11553-USB
ISBN:9781457717680
Pages:0
Format:Usb
Notes: Authorized distributor of all IEEE proceedings
Publ:Institute of Electrical and Electronics Engineers ( IEEE )
POD Publ:Curran Associates, Inc. ( Dec 2011 )
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