ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 12TH 2011. (ICEPT-HDP 2011) (USB)

ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 12TH 2011. (ICEPT-HDP 2011) (USB)

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013135
$194.50 - $389.00
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Details

  • Title: 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP 2011)
  • Date/Location: Held 8-11 August 2011, Shanghai, China.
  • IEEE #: CFP11553-USB
  • ISBN: 9781457717680
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Dec 2011 )

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  • Title: 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP 2011)
  • Date/Location: Held 8-11 August 2011, Shanghai, China.
  • IEEE #: CFP11553-USB
  • ISBN: 9781457717680
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Dec 2011 )