DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING. IEEE INTERNATIONAL SYMPOSIUM. 17TH 2011. (SIITME 2011)

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013493
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  • Title: 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME 2011)
  • Date/Location: Held 20-23 October 2011, Timisoara, Romania.
  • IEEE #: CFP1107I-POD
  • ISBN: 9781457712760
  • Pages: 378 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2012 )

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  • Title: 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME 2011)
  • Date/Location: Held 20-23 October 2011, Timisoara, Romania.
  • IEEE #: CFP1107I-POD
  • ISBN: 9781457712760
  • Pages: 378 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2012 )