Details
- Title: 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME 2011)
- Date/Location: Held 20-23 October 2011, Timisoara, Romania.
- IEEE #: CFP1107I-POD
- ISBN: 9781457712760
- Pages: 378 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2012 )
Description
Members/Attendees
Tab 4
- Title: 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME 2011)
- Date/Location: Held 20-23 October 2011, Timisoara, Romania.
- IEEE #: CFP1107I-POD
- ISBN: 9781457712760
- Pages: 378 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2012 )