Details
- Title: 2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP 2011)
- Date/Location: Held 11-13 May 2011, Aix-en-Provence, France.
- IEEE #: CFP11DTI-POD
- ISBN: 9781612849058
- Pages: 400 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2012 )
Description
Members/Attendees
Tab 4
- Title: 2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP 2011)
- Date/Location: Held 11-13 May 2011, Aix-en-Provence, France.
- IEEE #: CFP11DTI-POD
- ISBN: 9781612849058
- Pages: 400 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2012 )