Details
- Title: 2011 International Symposium on Advanced Packaging Materials (APM 2011)
- Date/Location: Held 25-28 October 2011, Xiamen, China.
- IEEE #: CFP11MPP-POD
- ISBN: 9781467301480
- Pages: 488 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2012 )
Description
Members/Attendees
Tab 4
- Title: 2011 International Symposium on Advanced Packaging Materials (APM 2011)
- Date/Location: Held 25-28 October 2011, Xiamen, China.
- IEEE #: CFP11MPP-POD
- ISBN: 9781467301480
- Pages: 488 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2012 )