ADVANCED PACKAGING MATERIALS. INTERNATIONAL SYMPOSIUM. 2011. (APM 2011)

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Title:	2011 International Symposium on Advanced Packaging Materials (APM 2011)
Desc:	Proceedings of a meeting held 25-28 October 2011, Xiamen, China.
Sponsor:	Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:	CFP11MPP-POD
ISBN:	9781467301480
Pages:	488 (1 Vol)
Format:	Softcover
Publisher:	Institute of Electrical and Electronics Engineers ( IEEE )
Notes:	Authorized distributor of all IEEE proceedings
TOC:	View Table of Contents