 Title: | 2011 International Symposium on Advanced Packaging Materials (APM 2011) | Desc: | Proceedings of a meeting held 25-28 October 2011, Xiamen, China.
| Prod#: | CFP11MPP-POD | ISBN: | 9781467301480 | Pages: | 488 (1 Vol) | Format: | Softcover | Notes: | Authorized distributor of all IEEE proceedings | TOC: | View Table of Contents | Publ: | Institute of Electrical and Electronics Engineers ( IEEE ) | POD Publ: | Curran Associates, Inc. ( Feb 2012 ) |
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