DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS. SYMPOSIUM. 2011. (DTIP 2011) (CD-ROM)

DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS. SYMPOSIUM. 2011. (DTIP 2011) (CD-ROM)

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013579
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  • Title: 2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP 2011)
  • Date/Location: Held 11-13 May 2011, Aix-en-Provence, France.
  • IEEE #: CFP11DTI-CDR
  • ISBN: 9782355000140
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2012 )

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  • Title: 2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP 2011)
  • Date/Location: Held 11-13 May 2011, Aix-en-Provence, France.
  • IEEE #: CFP11DTI-CDR
  • ISBN: 9782355000140
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2012 )