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3DS-IC TEMPORARY BONDING TECHNOLOGY WORKSHOP. SEMICON TAIWAN. 2011.

3DS-IC TEMPORARY BONDING TECHNOLOGY WORKSHOP. SEMICON TAIWAN. 2011.

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3DS-IC TEMPORARY BONDING TECHNOLOGY WORKSHOP. SEMICON TAIWAN. 2011.
Item #: 13695
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Product Description
Title:SEMICON Taiwan 3DS-IC Temporary Bonding Technology Workshop 2011
Desc:Proceedings of a meeting held 9 September 2011, Hsinchu, Taiwan.
ISBN:9781618393890
Pages:111 (1 Vol)
Format:Softcover
TOC:View Table of Contents
Publ:Sematech
POD Publ:Curran Associates, Inc. ( Mar 2012 )
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