Conference Proceedings
Specialists
Home
>
Browse by Publisher
>
Sematech
>
3DS-IC TEMPORARY BONDING TECHNOLOGY WORKSHOP. SEMICON TAIWAN. 2011.
3DS-IC TEMPORARY BONDING TECHNOLOGY WORKSHOP. SEMICON TAIWAN. 2011.
Item #: 13695
Our Price:
$120.00
Title:
SEMICON Taiwan 3DS-IC Temporary Bonding Technology Workshop 2011
Desc:
Proceedings of a meeting held 9 September 2011, Hsinchu, Taiwan.
ISBN:
9781618393890
Pages:
111 (1 Vol)
Format:
Softcover
TOC:
View Table of Contents
Publ:
Sematech
POD Publ:
Curran Associates, Inc. ( Mar 2012 )
ELECTROSTATIC DISCHARGE IMPACT AND CONTROL WORKSHOP. 2000.
EXTREME ULTRA-VIOLET LITHOGRAPHY (EUVL) SYMPOSIUM. INTERNATIONAL. 3RD 2004. (4 VOLS)
EXTREME ULTRA-VIOLET LITHOGRAPHY (EUVL) SYMPOSIUM. INTERNATIONAL. 2ND 2003. (3 VOLS)
Aerospace
Agriculture
Biology - Medicine
Chemical - Petroleum
Civil
Electrical - Computer
Environmental
Geoscience - Mining
Materials Science
Mechanical
Nanotechnology
Physics - Nuclear - Math
Other
