 Title: | SEMICON Taiwan 3DS-IC Temporary Bonding Technology Workshop 2011 | Desc: | Proceedings of a meeting held 9 September 2011, Hsinchu, Taiwan.
| ISBN: | 9781618393890 | Pages: | 111 (1 Vol) | Format: | Softcover | TOC: | View Table of Contents | Publ: | Sematech | POD Publ: | Curran Associates, Inc. ( Mar 2012 ) |
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