 Title: | 2.5D, 3D and Beyond: Bringing 3D Integration to the Packaging Mainstream 2011 | Desc: | Proceedings of a meeting held 9 November 2011, Santa Clara, California, USA.
| ISBN: | 9781618394507 | Pages: | 129 (1 Vol) | Format: | Softcover | TOC: | View Table of Contents | Publ: | Microelectronics Packaging and Test Engineering Council ( MEPTEC ) | POD Publ: | Curran Associates, Inc. ( Mar 2012 ) |
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