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2.5D, 3D AND BEYOND: BRINGING 3D INTEGRATION TO THE PACKAGING MAINSTREAM. SYMPOSIUM. 2011.
2.5D, 3D AND BEYOND: BRINGING 3D INTEGRATION TO THE PACKAGING MAINSTREAM. SYMPOSIUM. 2011.
Item #: 13881
Our Price:
$120.00
Title:
2.5D, 3D and Beyond: Bringing 3D Integration to the Packaging Mainstream 2011
Desc:
Proceedings of a meeting held 9 November 2011, Santa Clara, California, USA.
ISBN:
9781618394507
Pages:
129 (1 Vol)
Format:
Softcover
TOC:
View Table of Contents
Publ:
Microelectronics Packaging and Test Engineering Council ( MEPTEC )
POD Publ:
Curran Associates, Inc. ( Mar 2012 )
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