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2.5D, 3D AND BEYOND: BRINGING 3D INTEGRATION TO THE PACKAGING MAINSTREAM. SYMPOSIUM. 2011.

2.5D, 3D AND BEYOND: BRINGING 3D INTEGRATION TO THE PACKAGING MAINSTREAM. SYMPOSIUM. 2011.

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2.5D, 3D AND BEYOND: BRINGING 3D INTEGRATION TO THE PACKAGING MAINSTREAM. SYMPOSIUM. 2011.
Item #: 13881
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Product Description
Title:2.5D, 3D and Beyond: Bringing 3D Integration to the Packaging Mainstream 2011
Desc:Proceedings of a meeting held 9 November 2011, Santa Clara, California, USA.
ISBN:9781618394507
Pages:129 (1 Vol)
Format:Softcover
TOC:View Table of Contents
Publ:Microelectronics Packaging and Test Engineering Council ( MEPTEC )
POD Publ:Curran Associates, Inc. ( Mar 2012 )
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