Details
- Title: 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2012)
- Date/Location: Held 22-23 May 2012, Tokyo, Japan.
- IEEE #: CFP1218S-CDR
- ISBN: 9781467307413
- Format: CD-ROM
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2012 )
Description
Members/Attendees
Tab 4
- Title: 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2012)
- Date/Location: Held 22-23 May 2012, Tokyo, Japan.
- IEEE #: CFP1218S-CDR
- ISBN: 9781467307413
- Format: CD-ROM
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2012 )