Details
- Title: 2011 IEEE International 3D Systems Integration Conference (3DIC 2011)
- Date/Location: Held 31 January - 2 February 2012, Osaka, Japan. (Postponed from Oct 2011)
- IEEE #: CFP11DIC-POD
- ISBN: 9781467321891
- Pages: 513 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2012 )
Description
Members/Attendees
Tab 4
- Title: 2011 IEEE International 3D Systems Integration Conference (3DIC 2011)
- Date/Location: Held 31 January - 2 February 2012, Osaka, Japan. (Postponed from Oct 2011)
- IEEE #: CFP11DIC-POD
- ISBN: 9781467321891
- Pages: 513 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2012 )