3D SYSTEMS INTEGRATION CONFERENCE. IEEE INTERNATIONAL 2011. (3DIC 2011)

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Title:	2011 IEEE International 3D Systems Integration Conference (3DIC 2011)
Desc:	Proceedings of a meeting held 31 January - 2 February 2012, Osaka, Japan. (Postponed from Oct 2011)
Sponsor:	Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:	CFP11DIC-POD
ISBN:	9781467321891
Pages:	513 (1 Vol)
Format:	Softcover
Publisher:	Institute of Electrical and Electronics Engineers ( IEEE )
Notes:	Authorized distributor of all IEEE proceedings
TOC:	View Table of Contents