Details
- Title: 2013 IEEE International Symposium on Advanced Packaging Materials (APM 2013)
- Date/Location: Held 27 February - 1 March 2013, Irvine, California, USA.
- IEEE #: CFP13MPP-POD
- ISBN: 9781467360937
- Pages: 300 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2013 )
Description
Members/Attendees
Tab 4
- Title: 2013 IEEE International Symposium on Advanced Packaging Materials (APM 2013)
- Date/Location: Held 27 February - 1 March 2013, Irvine, California, USA.
- IEEE #: CFP13MPP-POD
- ISBN: 9781467360937
- Pages: 300 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2013 )