3D INTERCONNECT METROLOGY. WORKSHOP. 2013.

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019855
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Details

  • Title: Workshop on 3D Interconnect Metrology 2013
  • Date/Location: Held 10 July 2013, San Francisco, California, USA.
  • ISBN: 9781629932316
  • Pages: 229 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Sematech
  • POD Publisher: Curran Associates, Inc. ( Feb 2014 )

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  • Title: Workshop on 3D Interconnect Metrology 2013
  • Date/Location: Held 10 July 2013, San Francisco, California, USA.
  • ISBN: 9781629932316
  • Pages: 229 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Sematech
  • POD Publisher: Curran Associates, Inc. ( Feb 2014 )