THERMAL INVESTIGATIONS OF ICS AND SYSTEMS. INTERNATIONAL WORKSHOP. 19TH 2013. (THERMINIC 2013)

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020219
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  • Title: 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2013)
  • Date/Location: Held 25-27 September 2013, Berlin, Germany.
  • IEEE #: CFP13TII-POD
  • ISBN: 9781479922734
  • Pages: 388 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2014 )

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  • Title: 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2013)
  • Date/Location: Held 25-27 September 2013, Berlin, Germany.
  • IEEE #: CFP13TII-POD
  • ISBN: 9781479922734
  • Pages: 388 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2014 )