Details
- Title: 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME 2013)
- Date/Location: Held 24-27 October 2013, Galati, Romania.
- IEEE #: CFP1307I-POD
- ISBN: 9781479915545
- Pages: 293 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2014 )
Description
Members/Attendees
Tab 4
- Title: 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME 2013)
- Date/Location: Held 24-27 October 2013, Galati, Romania.
- IEEE #: CFP1307I-POD
- ISBN: 9781479915545
- Pages: 293 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2014 )