Details
- Title: 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME 2014)
- Date/Location: Held 23-26 October 2014, Bucharest, Romania.
- IEEE #: CFP1407I-POD
- ISBN: 9781479969630
- Pages: 344 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2015 )
Description
Members/Attendees
Tab 4
- Title: 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME 2014)
- Date/Location: Held 23-26 October 2014, Bucharest, Romania.
- IEEE #: CFP1407I-POD
- ISBN: 9781479969630
- Pages: 344 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2015 )