Details
- Title: 2015 International 3D Systems Integration Conference (3DIC 2015)
- Date/Location: Held 31 August - 2 September 2015, Sendai, Japan.
- IEEE #: CFP15DIC-POD
- ISBN: 9781467393867
- Pages: 353 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2016 )
Description
Members/Attendees
Tab 4
- Title: 2015 International 3D Systems Integration Conference (3DIC 2015)
- Date/Location: Held 31 August - 2 September 2015, Sendai, Japan.
- IEEE #: CFP15DIC-POD
- ISBN: 9781467393867
- Pages: 353 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2016 )