Details
- Title: 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME 2015)
- Date/Location: Held 22-25 October 2015, Brasov, Romania.
- IEEE #: CFP1507I-POD
- ISBN: 9781509003334
- Pages: 412 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2016 )
Description
Members/Attendees
Tab 4
- Title: 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME 2015)
- Date/Location: Held 22-25 October 2015, Brasov, Romania.
- IEEE #: CFP1507I-POD
- ISBN: 9781509003334
- Pages: 412 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2016 )