Details
- Title: 2016 IEEE International 3D Systems Integration Conference (3DIC 2016)
- Date/Location: Held 8-11 November 2016, San Francisco, California, USA.
- IEEE #: CFP16DIC-POD
- ISBN: 9781509014002
- Pages: 211 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2017 )
Description
Members/Attendees
Tab 4
- Title: 2016 IEEE International 3D Systems Integration Conference (3DIC 2016)
- Date/Location: Held 8-11 November 2016, San Francisco, California, USA.
- IEEE #: CFP16DIC-POD
- ISBN: 9781509014002
- Pages: 211 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2017 )