Details
- Title: 2017 International Conference on Biometrics and Kansei Engineering (ICBAKE 2017)
- Date/Location: Held 15-17 September 2017, Kyoto, Japan.
- IEEE #: CFP1716H-POD
- ISBN: 9781538634028
- Pages: 170 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2017 )
Description
Members/Attendees
Tab 4
- Title: 2017 International Conference on Biometrics and Kansei Engineering (ICBAKE 2017)
- Date/Location: Held 15-17 September 2017, Kyoto, Japan.
- IEEE #: CFP1716H-POD
- ISBN: 9781538634028
- Pages: 170 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2017 )