BIOMETRICS AND KANSEI ENGINEERING. INTERNATIONAL CONFERENCE. 2017. (ICBAKE 2017)

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Title:	2017 International Conference on Biometrics and Kansei Engineering (ICBAKE 2017)
Desc:	Proceedings of a meeting held 15-17 September 2017, Kyoto, Japan.
Prod#:	CFP1716H-POD
ISBN:	9781538634028
Pages:	170 (1 Vol)
Format:	Softcover
Notes:	Authorized distributor of all IEEE proceedings
TOC:	View Table of Contents
Publ:	Institute of Electrical and Electronics Engineers ( IEEE )
POD Publ:	Curran Associates, Inc. ( Nov 2017 )