Details
- Title: 2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM 2017)
- Date/Location: Held 8-11 November 2017, Nanjing, China.
- IEEE #: CFP17H23-POD
- ISBN: 9781538635070
- Pages: 337 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2018 )
Description
Members/Attendees
Tab 4
- Title: 2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM 2017)
- Date/Location: Held 8-11 November 2017, Nanjing, China.
- IEEE #: CFP17H23-POD
- ISBN: 9781538635070
- Pages: 337 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2018 )