Details
- Title: 2017 International Conference on Advanced Computing and Applications (ACOMP 2017)
- Date/Location: Held 29 November - 1 December 2017, Ho Chi Minh City, Vietnam.
- IEEE #: CFP17E01-POD
- ISBN: 9781538606087
- Pages: 154 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2018 )
Description
Members/Attendees
Tab 4
- Title: 2017 International Conference on Advanced Computing and Applications (ACOMP 2017)
- Date/Location: Held 29 November - 1 December 2017, Ho Chi Minh City, Vietnam.
- IEEE #: CFP17E01-POD
- ISBN: 9781538606087
- Pages: 154 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2018 )