Details
- Title: 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2018)
- Date/Location: Held 29 May - 1 June 2018, San Diego, California, USA.
- IEEE #: CFP18ITH-POD
- ISBN: 9781538612736
- Pages: 1,402 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2018)
- Date/Location: Held 29 May - 1 June 2018, San Diego, California, USA.
- IEEE #: CFP18ITH-POD
- ISBN: 9781538612736
- Pages: 1,402 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2018 )