THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. IEEE INTERSOCIETY CONFERENCE. 17TH 2018. (ITherm 2018) (2 VOLS)

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040092
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  • Title: 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2018)
  • Date/Location: Held 29 May - 1 June 2018, San Diego, California, USA.
  • IEEE #: CFP18ITH-POD
  • ISBN: 9781538612736
  • Pages: 1,402 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Aug 2018 )

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  • Title: 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2018)
  • Date/Location: Held 29 May - 1 June 2018, San Diego, California, USA.
  • IEEE #: CFP18ITH-POD
  • ISBN: 9781538612736
  • Pages: 1,402 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Aug 2018 )