Details
- Title: 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2018)
- Date/Location: Held 12-14 June 2018, Oulu, Finland.
- IEEE #: CFP18M25-POD
- ISBN: 9781538680193
- Pages: 99 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2018)
- Date/Location: Held 12-14 June 2018, Oulu, Finland.
- IEEE #: CFP18M25-POD
- ISBN: 9781538680193
- Pages: 99 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2018 )