SEMICONDUCTOR WAFER BONDING 9: SCIENCE, TECHNOLOGY, AND APPLICATIONS. (210TH ECS MEETING)

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040282
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Details

  • Title: Semiconductor Wafer Bonding 9: Science, Technology, and Applications
  • Subtitle: 210th ECS Meeting
  • Date/Location: Held 30 October - 2 November 2006, Cancun, Mexico.
  • Series: ECS Transactions Volume 3 No.06
  • Editor: Baumgart, H. et al.
  • ISBN: 9781510866546
  • Pages: 386 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Aug 2018 )

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Tab 4

 
  • Title: Semiconductor Wafer Bonding 9: Science, Technology, and Applications
  • Subtitle: 210th ECS Meeting
  • Date/Location: Held 30 October - 2 November 2006, Cancun, Mexico.
  • Series: ECS Transactions Volume 3 No.06
  • Editor: Baumgart, H. et al.
  • ISBN: 9781510866546
  • Pages: 386 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Aug 2018 )