Conference Proceedings
Home
 > 
Browse by Publisher
 > 
Electrochemical Society ( ECS )
 > 
SEMICONDUCTOR WAFER BONDING 9: SCIENCE, TECHNOLOGY, AND APPLICATIONS. (210TH ECS MEETING)

SEMICONDUCTOR WAFER BONDING 9: SCIENCE, TECHNOLOGY, AND APPLICATIONS. (210TH ECS MEETING)

Send a Friend    
SEMICONDUCTOR WAFER BONDING 9: SCIENCE, TECHNOLOGY, AND APPLICATIONS. (210TH ECS MEETING)
Item #: 40282
Our Price:   
$84.00
Pricing: ECS Member # :
Product Description
Title:Semiconductor Wafer Bonding 9: Science, Technology, and Applications
Desc:Proceedings of a meeting held 30 October - 2 November 2006, Cancun, Mexico. 210th ECS Meeting
Series:ECS Transactions Volume 3 No.06
Editor:Baumgart, H. et al.
ISBN:9781510866546
Pages:386 (1 Vol)
Format:Softcover
TOC:View Table of Contents
Publ:Electrochemical Society ( ECS )
POD Publ:Curran Associates, Inc. ( Aug 2018 )
Related Products
Browse By PublisherShop By Category
Dave A Curran, EzineArticles.com Basic Author