SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY, AND APPLICATIONS 15. (AIMES 2018)

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041211
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  • Title: Semiconductor Wafer Bonding: Science, Technology and Applications 15
  • Subtitle: AiMES 2018
  • Date/Location: Held 30 September - 4 October 2018, Cancun, Mexico.
  • Series: ECS Transactions Volume 86 No.05
  • Editor: Tan, C. S. et al.
  • ISBN: 9781510871656
  • Pages: 248 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Oct 2018 )

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  • Title: Semiconductor Wafer Bonding: Science, Technology and Applications 15
  • Subtitle: AiMES 2018
  • Date/Location: Held 30 September - 4 October 2018, Cancun, Mexico.
  • Series: ECS Transactions Volume 86 No.05
  • Editor: Tan, C. S. et al.
  • ISBN: 9781510871656
  • Pages: 248 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Oct 2018 )