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SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY, AND APPLICATIONS 15. (AIMES 2018)

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY, AND APPLICATIONS 15. (AIMES 2018)

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SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY, AND APPLICATIONS 15. (AIMES 2018)
Item #: 41211
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Product Description
Title:Semiconductor Wafer Bonding: Science, Technology and Applications 15
Desc:Proceedings of a meeting held 30 September - 4 October 2018, Cancun, Mexico. AiMES 2018
Series:ECS Transactions Volume 86 No.05
Editor:Tan, C. S. et al.
ISBN:9781510871656
Pages:248 (1 Vol)
Format:Softcover
TOC:View Table of Contents
Publ:Electrochemical Society ( ECS )
POD Publ:Curran Associates, Inc. ( Oct 2018 )
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