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MATERIALS, FORMULATION, AND PROCESSES FOR SEMICONDUCTOR, 2.5 AND 3D CHIP PACKAGING, AND HIGH DENSITY INTERCONNECTION PCB. (AIMES 2018)

MATERIALS, FORMULATION, AND PROCESSES FOR SEMICONDUCTOR, 2.5 AND 3D CHIP PACKAGING, AND HIGH DENSITY INTERCONNECTION PCB. (AIMES 2018)

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MATERIALS, FORMULATION, AND PROCESSES FOR SEMICONDUCTOR, 2.5 AND 3D CHIP PACKAGING, AND HIGH DENSITY INTERCONNECTION PCB. (AIMES 2018)
Item #: 41214
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Product Description
Title:Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB
Desc:Proceedings of a meeting held 30 September - 4 October 2018, Cancun, Mexico. AiMES 2018
Series:ECS Transactions Volume 86 No.08
Editor:Dow, W.-P. et al.
ISBN:9781510871687
Pages:49 (1 Vol)
Format:Softcover
Publ:Electrochemical Society ( ECS )
POD Publ:Curran Associates, Inc. ( Oct 2018 )
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