Details
- Title: 2018 IEEE ANDESCON
- Date/Location: Held 22-24 August 2018, Santiago de Cali, Colombia.
- IEEE #: CFP1861J-POD
- ISBN: 9781538683736
- Pages: 591 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE ANDESCON
- Date/Location: Held 22-24 August 2018, Santiago de Cali, Colombia.
- IEEE #: CFP1861J-POD
- ISBN: 9781538683736
- Pages: 591 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2019 )