Details
- Title: 2018 International Conference on Advanced Computing and Applications (ACOMP 2018)
- Date/Location: Held 27-29 November 2018, Ho Chi Minh City, Vietnam.
- IEEE #: CFP18E01-POD
- ISBN: 9781538691878
- Pages: 141 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 International Conference on Advanced Computing and Applications (ACOMP 2018)
- Date/Location: Held 27-29 November 2018, Ho Chi Minh City, Vietnam.
- IEEE #: CFP18E01-POD
- ISBN: 9781538691878
- Pages: 141 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2019 )