Details
- Title: 2018 3rd International Conference on Computational Intelligence and Applications (ICCIA 2018)
- Date/Location: Held 28-30 July 2018, Hong Kong.
- IEEE #: CFP18H62-POD
- ISBN: 9781538695722
- Pages: 272 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 3rd International Conference on Computational Intelligence and Applications (ICCIA 2018)
- Date/Location: Held 28-30 July 2018, Hong Kong.
- IEEE #: CFP18H62-POD
- ISBN: 9781538695722
- Pages: 272 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2019 )