Details
- Title: 2019 IEEE Workshop on Applications of Signal Processing to Audio and Acoustics (WASPAA 2019)
- Date/Location: Held 20-23 October 2019, New Paltz, New York, USA.
- IEEE #: CFP19AUD-POD
- ISBN: 9781728111247
- Pages: 397 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE Workshop on Applications of Signal Processing to Audio and Acoustics (WASPAA 2019)
- Date/Location: Held 20-23 October 2019, New Paltz, New York, USA.
- IEEE #: CFP19AUD-POD
- ISBN: 9781728111247
- Pages: 397 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2020 )