ADVANCES IN COMPUTING, COMMUNICATION AND MATERIALS. INTERNATIONAL CONFERENCE. 2020. (ICACCM 2020)

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056123
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Details

  • Title: 2020 International Conference on Advances in Computing, Communication & Materials (ICACCM 2020)
  • Date/Location: Held 21-22 August 2020, Dehradun, India.
  • IEEE #: CFP20UAA-POD
  • ISBN: 9781728197869
  • Pages: 453 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Dec 2020 )

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Tab 4

 
  • Title: 2020 International Conference on Advances in Computing, Communication & Materials (ICACCM 2020)
  • Date/Location: Held 21-22 August 2020, Dehradun, India.
  • IEEE #: CFP20UAA-POD
  • ISBN: 9781728197869
  • Pages: 453 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Dec 2020 )