Conference Proceedings
Home
 > 
Browse by Publisher
 > 
Electrochemical Society ( ECS )
 > 
CLEANING AND SURFACE CONDITIONING TECHNOLOGY IN SEMICONDUCTOR DEVICE MANUFACTURING 10. (212TH ECS MEETING)

CLEANING AND SURFACE CONDITIONING TECHNOLOGY IN SEMICONDUCTOR DEVICE MANUFACTURING 10. (212TH ECS MEETING)

Send a Friend    
CLEANING AND SURFACE CONDITIONING TECHNOLOGY IN SEMICONDUCTOR DEVICE MANUFACTURING 10. (212TH ECS MEETING)
Item #: 56484
Our Price:   
$109.00
Pricing: ECS Member # :
Product Description
Title:Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 10
Desc:Proceedings of a meeting held 7-12 October 2007, Washington, DC, USA. 212th ECS Meeting
Series:ECS Transactions Volume 11 No.02
Editor:Hattori, T. et al.
ISBN:9781713819615
Pages:481 (1 Vol)
Format:Softcover
TOC:View Table of Contents
Publ:Electrochemical Society ( ECS )
POD Publ:Curran Associates, Inc. ( Nov 2020 )
Related Products
CORROSION PROTECTIVE COATINGS AND INHIBITORS. (AT 208TH ECS MEETING)
CORROSION PROTECTIVE COATINGS AND INHIBITORS. (AT 208TH ECS MEETING)
ATOMIC LAYER DEPOSITION. (AT 208TH ECS MEETING)
ATOMIC LAYER DEPOSITION. (AT 208TH ECS MEETING)
COPPER INTERCONNECTS, NEW CONTACT AND BARRIER METALLURGIES/STRUCTURES, AND LOW-K INTERLEVEL DIELECTRICS III. (AT 208TH ECS MEETING)
COPPER INTERCONNECTS, NEW CONTACT AND BARRIER METALLURGIES/STRUCTURES, AND LOW-K INTERLEVEL DIELECTRICS III. (AT 208TH ECS MEETING)
Browse By PublisherShop By Category
Partner With Us
Dave A Curran, EzineArticles.com Basic Author