Conference Proceedings
Home
 > 
Browse by Publisher
 > 
Electrochemical Society ( ECS )
 > 
COPPER INTERCONNECTS, NEW CONTACT AND BARRIER METALLURGIES/STRUCTURES, AND LOW-K INTERLEVEL DIELECTRICS III. (AT 208TH ECS MEETING)

COPPER INTERCONNECTS, NEW CONTACT AND BARRIER METALLURGIES/STRUCTURES, AND LOW-K INTERLEVEL DIELECTRICS III.          (AT 208TH ECS MEETING)

Send a Friend    
COPPER INTERCONNECTS, NEW CONTACT AND BARRIER METALLURGIES/STRUCTURES, AND LOW-K INTERLEVEL DIELECTRICS III. (AT 208TH ECS MEETING)
Item #: 00353
Our Price:   
$80.00
Pricing: ECS Member # :
Product Description
Title:Copper Interconnects, New Contact and Barrier Metallurgies/Structures, and Low-k Interlevel Dielectrics III
Desc:Proceedings of a meeting held 16-21 October 2005, Los Angeles, California. Held at 208TH ECS Meeting
Series:ECS Transactions Volume 1 No.11
Editor:Mathad, G.
ISBN:9781566774994
Pages:186 (1 Vol)
Format:Softcover
TOC:View Table of Contents
Publ:Electrochemical Society ( ECS )
POD Publ:Curran Associates, Inc. ( Dec 2006 )
Related Products
Browse By PublisherShop By Category
Dave A Curran, EzineArticles.com Basic Author