 Title: | Copper Interconnects, New Contact and Barrier Metallurgies/Structures, and Low-k Interlevel Dielectrics III | Desc: | Proceedings of a meeting held 16-21 October 2005, Los Angeles, California.
Held at 208TH ECS Meeting | Series: | ECS Transactions Volume 1 No.11 | Editor: | Mathad, G. | ISBN: | 9781566774994 | Pages: | 186 (1 Vol) | Format: | Softcover | TOC: | View Table of Contents | Publ: | Electrochemical Society ( ECS ) | POD Publ: | Curran Associates, Inc. ( Dec 2006 ) |
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