COPPER INTERCONNECTS, NEW CONTACT AND BARRIER METALLURGIES/STRUCTURES, AND LOW-K INTERLEVEL DIELECTRICS III. (AT 208TH ECS MEETING)

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Title:	Copper Interconnects, New Contact and Barrier Metallurgies/Structures, and Low-k Interlevel Dielectrics III
Desc:	Proceedings of a meeting held 16-21 October 2005, Los Angeles, California. Held at 208TH ECS Meeting
Series:	ECS Transactions Volume 1 No.11
Editor:	Mathad, G.
ISBN:	9781566774994
Pages:	186 (1 Vol)
Format:	Softcover
TOC:	View Table of Contents
Publ:	Electrochemical Society (ECS)
POD Publ:	Curran Associates, Inc. ( Dec 2006 )