Details
- Title: Copper Interconnects, New Contact and Barrier Metallurgies/Structures, and Low-k Interlevel Dielectrics III
- Subtitle: Held at 208TH ECS Meeting
- Date/Location: Held 16-21 October 2005, Los Angeles, California.
- Series: ECS Transactions Volume 1 No.11
- Editor: Mathad, G.
- ISBN: 9781566774994
- Pages: 186 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Dec 2006 )
Description
Members/Attendees
Tab 4
- Title: Copper Interconnects, New Contact and Barrier Metallurgies/Structures, and Low-k Interlevel Dielectrics III
- Subtitle: Held at 208TH ECS Meeting
- Date/Location: Held 16-21 October 2005, Los Angeles, California.
- Series: ECS Transactions Volume 1 No.11
- Editor: Mathad, G.
- ISBN: 9781566774994
- Pages: 186 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Dec 2006 )