Details
- Title: 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
- Date/Location: Held 10-12 December 2008, Seoul, Korea.
- IEEE #: CFP08EDP-POD
- ISBN: 9781424426331
- Pages: 225 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2009 )
Description
Members/Attendees
Tab 4
- Title: 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
- Date/Location: Held 10-12 December 2008, Seoul, Korea.
- IEEE #: CFP08EDP-POD
- ISBN: 9781424426331
- Pages: 225 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2009 )