ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 2009. (ICEPT-HDP 2009) (CD-ROM)

ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 2009. (ICEPT-HDP 2009) (CD-ROM)

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006177
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Details

  • Title: 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009)
  • Date/Location: Held 10-13 August 2009, Beijing, China.
  • Editor: Bi, K.
  • IEEE #: CFP09553-CDR
  • ISBN: 9781424446599
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Sep 2009 )

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  • Title: 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009)
  • Date/Location: Held 10-13 August 2009, Beijing, China.
  • Editor: Bi, K.
  • IEEE #: CFP09553-CDR
  • ISBN: 9781424446599
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Sep 2009 )