Details
- Title: 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009)
- Date/Location: Held 10-13 August 2009, Beijing, China.
- Editor: Bi, K.
- IEEE #: CFP09553-CDR
- ISBN: 9781424446599
- Format: CD-ROM
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2009 )
Description
Members/Attendees
Tab 4
- Title: 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009)
- Date/Location: Held 10-13 August 2009, Beijing, China.
- Editor: Bi, K.
- IEEE #: CFP09553-CDR
- ISBN: 9781424446599
- Format: CD-ROM
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2009 )