Details
- Title: 2009 IEEE International Conference on 3D System Integration (3DIC 2009)
- Date/Location: Held 28-30 September 2009, San Francisco, California.
- IEEE #: CFP09DIC-POD
- ISBN: 9781424445110
- Pages: 446 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2009 )
Description
Members/Attendees
Tab 4
- Title: 2009 IEEE International Conference on 3D System Integration (3DIC 2009)
- Date/Location: Held 28-30 September 2009, San Francisco, California.
- IEEE #: CFP09DIC-POD
- ISBN: 9781424445110
- Pages: 446 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2009 )