INTERCONNECT TECHNOLOGY CONFERENCE. IEEE INTERNATIONAL. 2011. (AND 2011 MATERIALS FOR ADVANCED METALLIZATION) (IITC/MAM 2011)

Item #:
012014
$121.00 - $242.00
Adding to cart… The item has been added

Details

  • Title: 2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM 2011)
  • Date/Location: Held 8-12 May 2011, Dresden, Germany.
  • IEEE #: CFP11ITR-POD
  • ISBN: 9781457705038
  • Pages: 312 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Aug 2011 )

Description

 

Members/Attendees

 

Tab 4

 
  • Title: 2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM 2011)
  • Date/Location: Held 8-12 May 2011, Dresden, Germany.
  • IEEE #: CFP11ITR-POD
  • ISBN: 9781457705038
  • Pages: 312 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Aug 2011 )