Details
- Title: 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2012)
- Date/Location: Held 9-11 December 2012, Taipei, Taiwan.
- IEEE #: CFP12EDP-POD
- ISBN: 9781467314442
- Pages: 246 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2013 )
Description
Members/Attendees
Tab 4
- Title: 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2012)
- Date/Location: Held 9-11 December 2012, Taipei, Taiwan.
- IEEE #: CFP12EDP-POD
- ISBN: 9781467314442
- Pages: 246 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2013 )