Details
- Title: 2013 IEEE International 3D Systems Integration Conference (3DIC 2013)
- Date/Location: Held 2-4 October 2013, San Francisco, California, USA.
- IEEE #: CFP13DIC-POD
- ISBN: 9781467364829
- Pages: 499 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2014 )
Description
Members/Attendees
Tab 4
- Title: 2013 IEEE International 3D Systems Integration Conference (3DIC 2013)
- Date/Location: Held 2-4 October 2013, San Francisco, California, USA.
- IEEE #: CFP13DIC-POD
- ISBN: 9781467364829
- Pages: 499 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2014 )