Details
- Title: 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2018)
- Date/Location: Held 25-27 June 2018, College Park, Maryland, USA.
- IEEE #: CFP18G64-POD
- ISBN: 9781538660188
- Pages: 45 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2018)
- Date/Location: Held 25-27 June 2018, College Park, Maryland, USA.
- IEEE #: CFP18G64-POD
- ISBN: 9781538660188
- Pages: 45 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2018 )