3D POWER ELECTRONICS INTEGRATION AND MANUFACTURING. INTERNATIONAL SYMPOSIUM. 2ND 2018. (3D-PEIM 2018)

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041597
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  • Title: 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2018)
  • Date/Location: Held 25-27 June 2018, College Park, Maryland, USA.
  • IEEE #: CFP18G64-POD
  • ISBN: 9781538660188
  • Pages: 45 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Nov 2018 )

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  • Title: 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2018)
  • Date/Location: Held 25-27 June 2018, College Park, Maryland, USA.
  • IEEE #: CFP18G64-POD
  • ISBN: 9781538660188
  • Pages: 45 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Nov 2018 )