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MATERIALS AND PROCESSES FOR SEMICONDUCTOR, 2.5 AND 3D CHIP PACKAGING AND HIGH DENSITY INTERCONNECTION PCB 2. (236TH ECS MEETING)

MATERIALS AND PROCESSES FOR SEMICONDUCTOR, 2.5 AND 3D CHIP PACKAGING AND HIGH DENSITY INTERCONNECTION PCB 2. (236TH ECS MEETING)

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MATERIALS AND PROCESSES FOR SEMICONDUCTOR, 2.5 AND 3D CHIP PACKAGING AND HIGH DENSITY INTERCONNECTION PCB 2. (236TH ECS MEETING)
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Product Description
Title:Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging and High Density Interconnection PCB 2
Desc:Proceedings of a meeting held 13-17 October 2019, Atlanta, Georgia, USA. 236th ECS Meeting
Series:ECS Transactions Volume 92 No.05
Editor:Dow, W.-P. et al.
ISBN:9781510895911
Pages:47 (1 Vol)
Format:Softcover
TOC:View Table of Contents
Publ:Electrochemical Society ( ECS )
POD Publ:Curran Associates, Inc. ( Nov 2019 )
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