MATERIALS AND PROCESSES FOR SEMICONDUCTOR, 2.5 AND 3D CHIP PACKAGING AND HIGH DENSITY INTERCONNECTION PCB 2. (236TH ECS MEETING)

MATERIALS AND PROCESSES FOR SEMICONDUCTOR, 2.5 AND 3D CHIP PACKAGING AND HIGH DENSITY INTERCONNECTION PCB 2. (236TH ECS MEETING)

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051021
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Details

  • Title: Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging and High Density Interconnection PCB 2
  • Subtitle: 236th ECS Meeting
  • Date/Location: Held 13-17 October 2019, Atlanta, Georgia, USA.
  • Series: ECS Transactions Volume 92 No.05
  • Editor: Dow, W.-P. et al.
  • ISBN: 9781510895911
  • Pages: 47 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Nov 2019 )

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Tab 4

 
  • Title: Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging and High Density Interconnection PCB 2
  • Subtitle: 236th ECS Meeting
  • Date/Location: Held 13-17 October 2019, Atlanta, Georgia, USA.
  • Series: ECS Transactions Volume 92 No.05
  • Editor: Dow, W.-P. et al.
  • ISBN: 9781510895911
  • Pages: 47 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Nov 2019 )