Details
- Title: 2019 IEEE Cloud Summit
- Date/Location: Held 8-10 August 2019, Washington, DC, USA.
- IEEE #: CFP19U01-POD
- ISBN: 9781728131023
- Pages: 125 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE Cloud Summit
- Date/Location: Held 8-10 August 2019, Washington, DC, USA.
- IEEE #: CFP19U01-POD
- ISBN: 9781728131023
- Pages: 125 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2020 )