 Title: | 2019 International 3D Systems Integration Conference (3DIC 2019) | Desc: | Proceedings of a meeting held 8-10 October 2019, Sendai, Japan.
| Prod#: | CFP19DIC-POD | ISBN: | 9781728148717 | Pages: | 286 (1 Vol) | Format: | Softcover | Notes: | Authorized distributor of all IEEE proceedings | TOC: | View Table of Contents | Publ: | Institute of Electrical and Electronics Engineers ( IEEE ) | POD Publ: | Curran Associates, Inc. ( Jul 2020 ) |
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