Details
- Title: 2019 International 3D Systems Integration Conference (3DIC 2019)
- Date/Location: Held 8-10 October 2019, Sendai, Japan.
- IEEE #: CFP19DIC-POD
- ISBN: 9781728148717
- Pages: 286 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 International 3D Systems Integration Conference (3DIC 2019)
- Date/Location: Held 8-10 October 2019, Sendai, Japan.
- IEEE #: CFP19DIC-POD
- ISBN: 9781728148717
- Pages: 286 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2020 )