Details
- Title: 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis
- Date/Location: Held 27-30 June 2006, Shanghai, China.
- IEEE #: CFP06579-POD
- ISBN: 9781424404889
- Pages: 328 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2007 )
Description
Members/Attendees
Tab 4
- Title: 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis
- Date/Location: Held 27-30 June 2006, Shanghai, China.
- IEEE #: CFP06579-POD
- ISBN: 9781424404889
- Pages: 328 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2007 )