Details
- Title: 3rd Annual Technical Symposium on Thermal Management in Microelectronics 2007
- Subtitle: The Heat is On: Thermal Management in Microelectronics
- Date/Location: Held 15 February 2007, San Jose, California.
- ISBN: 9781605601519
- Pages: 271 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
- POD Publisher: Curran Associates, Inc. ( Jun 2008 )
Description
Members/Attendees
Tab 4
- Title: 3rd Annual Technical Symposium on Thermal Management in Microelectronics 2007
- Subtitle: The Heat is On: Thermal Management in Microelectronics
- Date/Location: Held 15 February 2007, San Jose, California.
- ISBN: 9781605601519
- Pages: 271 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
- POD Publisher: Curran Associates, Inc. ( Jun 2008 )