Details
- Title: Technical Symposium on Substrates: The Foundation of Semiconductor Packaging 2007
- Date/Location: Held 8 November 2007, San Jose, California.
- ISBN: 9781605601526
- Pages: 341 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
- POD Publisher: Curran Associates, Inc. ( Jun 2008 )
Description
Members/Attendees
Tab 4
- Title: Technical Symposium on Substrates: The Foundation of Semiconductor Packaging 2007
- Date/Location: Held 8 November 2007, San Jose, California.
- ISBN: 9781605601526
- Pages: 341 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
- POD Publisher: Curran Associates, Inc. ( Jun 2008 )